Charting Growth Paths: Radiation Hardened Electronics Market Dynamics
The Radiation Hardened Electronics Market Size is anticipated to increase at a compound annual growth rate (CAGR) of 4.8% from USD 1.7 billion in 2024 to USD 2.1 billion by 2029. The growing requirement for sturdy and dependable electronic components in radiation-prone areas including space, nuclear power plants, and military applications is what is fueling this expansion. The need for radiation-hardened components, which guarantee the longevity and operation of vital systems in harsh environments, is growing as technology progresses. Electronic equipment are becoming more radiation-tolerant thanks to advancements in design and materials. Furthermore, the need for sophisticated radiation-hardened electronics is becoming more and more apparent as space exploration missions expand and as national security becomes more and more important.
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There is a noticeable increase in the use of devices that have been radiation-hardened in military missions. Drones, tanks, and fighter jets are examples of modern military equipment that are integrating a growing number of complex electronic systems. For communication, navigation, targeting, and the general effectiveness of the operation, these systems are essential. On the other hand, they frequently encounter challenging and complex electromagnetic settings in the battlefield. By shielding these electronic systems from the damaging effects of radiation and electromagnetic interference, radiation hardening maintains their dependable performance. Because the breakdown of electronic equipment can have mission-critical ramifications in modern warfare, this reliability is essential to preserving operational efficiency and effectiveness.
Mixed-signal ICs component to hold the significant market size of radiation-hardened electronics industry during the forecast period.
Analogue devices play a vital role in many applications and are essential parts of the semiconductor industry. Analog-to-digital conversion is a basic function needed to convert analogue signals into digital representations, especially in microcontrollers and signal processing systems. Furthermore, mixed-signal devices have the ability to process analogue and digital signals simultaneously, providing flexible capability in a range of applications. Depending on the particular needs of the application, these devices can be implemented as printed circuit boards, single integrated circuit (IC) chips, or hybrid microcircuits. These analogue devices need to be ruggedized to withstand the harmful effects of radiation on digital and analogue circuits in high-radiation environments like space and nuclear power plants or particle accelerators.
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Custom-made in product type segment is expected to grow at the second fastest CAGR during the forecast period.
Electronic components that are specifically designed to withstand radiation are crucial for use in harsh settings including nuclear power plants, space exploration, and high-energy physics research. In radiation-rich situations, these specialised components are made to withstand the damaging effects of radiation exposure, guaranteeing dependable functioning. Key offerings in the array of customised radiation-hardened electronic components are discrete power transistors, microprocessors, custom magnetics, fiber-optic components, analogue and mixed-signal processing components, and a customised digital application-specific integrated circuit (ASIC) platform. To ensure radiation toughness, each of these components goes through a thorough testing and design procedure. These components can continue to function and perform even in high radiation environments by utilising particular design elements and materials that lessen the effects of radiation-induced flaws and errors. They are also designed to satisfy the demanding specifications of the intended use, which include power conditioning, module layout considerations, mechanical shielding, and other support circuits.
ROW expected to grow with second highest CAGR the radiation-hardened market during the forecast period.
The Middle East, Africa, the Gulf Cooperation Council (GCC), and South America make up the Rest of the World (RoW) market, which is seeing notable growth due to advances in satellite technology. The satellite industry has seen a revolution with the introduction of hosted satellite launches and the creation of small satellites, which have reduced the cost of satellite manufacturing and launches to levels never seen before. The advancement of technology has created novel prospects for governments, scientific establishments, and organisations in regions of the world with limited resources to utilise space capabilities for a range of uses. Smallsats, sometimes referred to as CubeSats or smallsats, are more affordable than typical larger satellites and make space more accessible to a greater group of customers. Furthermore, the idea of hosted satellite launches minimises lead times and overall launch costs by allowing several satellites to use a single launch vehicle. RoW stakeholders have benefited greatly from this strategy, which has allowed them to launch satellites for a variety of uses at a lesser cost than dedicated missions and has given them more frequent access to space.
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Radiation Hardened Electronics Companies:
- Microchip Technology Inc.(US)
- BAE Systems (UK)
- Renesas Electronics Corporation (Japan)
- Infineon Technologies AG (Germany)
- STMicroelectronics (Switzerland), AMD (US)
- Texas Instruments Incorporated (US)
- Honeywell International Inc. (US)
- Teledyne Technologies Inc. (US)
- TTM Technologies, Inc. (US)
- Cobham Limited (UK)
- Analog Devices, Inc (US)
- Data Devices Corporation (US)
- 3D Plus (France)
- Mercury Systems, Inc. (US)
- PCB Piezotronics, Inc (US)
- Vorago (US)
- Micropac Industries, Inc (US)
- GSI technology, Inc (US)
- Everspin Technologies Inc (US)
- Semiconductor Components Industries, LLC (US)
- AiTech (US)
- Microelectronics Research Development Corporation (US)
- Space Micro, Inc (US)
- Triad Semiconductor (US).
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