Interposer and FOWLP Market Insights: What to Expect by 2029
The new research report " Interposer and Fan-out Wafer Level Packaging Market by Packaging Component & Design (Silicon, Organic, Glass, Ceramic), Packaging (2.5D, 3D), Device (Logic ICs, LEDs, Memory Devices, MEMS, Imaging & Optoelectronics), Industry - Global Forecast to 2029" reveals that the global interposer and fan-out wafer level packaging (FOWLP) market is expected to be valued at USD 35.6 billion in 2024 and projected to reach USD 63.5 billion by 2029, growing at a CAGR of 12.3% during the forecast period. The market's growth is primarily driven by the increasing demand for advanced packaging technologies in artificial intelligence (AI) and high-performance computing (HPC). These advanced packaging solutions enable enhanced performance, miniaturization, and energy efficiency in electronic devices, which are crucial for AI and HPC applications. The utilization of silicon, organic, glass, and ceramic materials in packaging designs like 2.5D and 3D structur