Semiconductor and Electronic Survey

The   Radiation Hardened Electronics Market   is expected to grow from USD 1.5 billion in 2022 to USD 1.8 billion by 2027, at a CAGR of 4.0% during the forecast period. Rising intelligence, surveillance, and reconnaissance (ISR) activities is expected to positively influence the growth opportunities for Radiation-Hardened Electronics Market. Continuous shrinking of weight and size and change in power consumption requirement of space electronics has led systems integrators toward the development of a kind of packaging technique, with more use of chiplets and heterogenous packaging of dies. The manufacturers are planning to integrate microprocessors, memory pieces, and serial interconnect in a single system package. Designers are also integrating RF components, D/A convertor, and A/D convertor in a single package, which requires advanced packaging. The evolution for multicore processors from two, to four and currently eight core is required for low earth orbital application. For example,