Semiconductor and Electronic Survey

The   Radiation Hardened Electronics Market   is poised for steady growth, expanding from USD 1.7 billion in 2024 to USD 2.1 billion by 2029, at a CAGR of 4.8%. This growth is driven by the increasing demand for electronics that can withstand high radiation environments, essential for applications in aerospace, defense, and nuclear power industries. Key components in this market include mixed signal ICs, processors & controllers, memory, and power management devices, which are manufactured using techniques like Radiation Hardening by Design (RHBD) and Radiation Hardening by Process (RHBP). The advancements in these manufacturing techniques ensure reliability and durability, making these electronics indispensable for critical applications where exposure to radiation is a significant concern. As technology continues to evolve, the  radiation-hardened electronics industry  is set to play a crucial role in ensuring the safe and efficient operation of systems in high-...

The   Radiation Hardened Electronics Market   is expected to grow from USD 1.5 billion in 2022 to USD 1.8 billion by 2027, at a CAGR of 4.0% during the forecast period. Rising intelligence, surveillance, and reconnaissance (ISR) activities is expected to positively influence the growth opportunities for Radiation-Hardened Electronics Market. Continuous shrinking of weight and size and change in power consumption requirement of space electronics has led systems integrators toward the development of a kind of packaging technique, with more use of chiplets and heterogenous packaging of dies. The manufacturers are planning to integrate microprocessors, memory pieces, and serial interconnect in a single system package. Designers are also integrating RF components, D/A convertor, and A/D convertor in a single package, which requires advanced packaging. The evolution for multicore processors from two, to four and currently eight core is required for low earth orbital application. For...