Packaging Prowess: The Rise of Interposer and FOWLP Market Technologies
According to the new research report " Interposer and Fan-out Wafer Level Packaging Market by Packaging Component & Design (Silicon, Organic, Glass, Ceramic), Packaging (2.5D, 3D), Device (Logic ICs, LEDs, Memory Devices, MEMS, Imaging & Optoelectronics), Industry - Global Forecast to 2029" The global interposer and FOWLP market is expected to be valued at USD 35.6 billion in 2024 and is projected to reach USD 63.5 billion by 2029; it is expected to grow at a CAGR of 12.3% during the forecast period. The increasing demand for advanced packaging in AI and high-performance computing (HPC) are the key drivers fueling the expansion of the interposer and FOWLP Market. Download PDF Brochure @ https://www.marketsandmarkets.com/pdfdownloadNew.asp?id=130599842 Based on packaging component & design Interposer and Fan-out Wafer Level Packaging market for Interposers to hold the highest market share during the forecast period. Interposer-based packaging is experiencing