Radiation-Hardened Electronics Market See Huge Growth in Coming Years
From 2022 to 2027, the Radiation Hardened Electronics Market is anticipated to increase from USD 1.5 billion to USD 1.8 billion, with a CAGR of 4.0%. The market for rad-hard electronics is expanding as a result of factors including the expansion of international intelligence, surveillance, and reconnaissance (ISR) operations, an increase in the number of space missions, and rising demand from the commercial satellite sector.
The COVID-19 catastrophe has caused a pandemic in both the economy and global health. As a result, some companies have shut down their manufacturing facilities and stopped the majority of their activities. The major goal of firms in this crisis is to maintain their operations by finding secure ways to carry on with manufacturing activities or looking into other sustainable ways to increase revenue. In the pre-COVID-19 scenario, the demand for radiation-hardened devices was rapidly rising. The immediate effect of COVID-19 on US imports of radiation-hardened devices can be plainly seen given the trade tensions between China and the US. Major semiconductor component imports include the US and Europe. The makers of radiation-hardened electronics situated in the US and Europe are suffering as a result of the high import tariffs on radiation-hardened electronic components in these regions as well as disruptions in their supply chain. A supply-demand mismatch might develop from this, which would have a detrimental effect on the market's expansion.
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In terms of component type, Power Management dominated the market for radiation-hardened electronics in 2019.
A significant market niche for radiation-hardened electronics has been power control. The need for MOSFETs and diodes for high-end applications in the aerospace and defence sectors is principally responsible for the expansion of the power management market. In 2019, the market for radiation-hardened electronics was dominated by power management components, such as metal-oxide-semiconductor field-effect transistors (MOSFETs) and power switches, which held a 40% market share. Power MOSFETs are utilised in high-reliability applications and created for space applications. These are extremely resistant to ionising radiation and high-energy charged particles. The ongoing COVID-19 pandemic has a minor impact on the power management segment's growth, but it is still anticipated to expand at the highest pace among the other components over the forecast period.
During the projection period, the Radiation Hardening by Design (RHBD) Manufacturing Technique is anticipated to expand at a faster CAGR.
Due to the low cost per chip, high volume of production, and simplicity of modification, the radiation hardening by design (RHBD) segment is anticipated to grow at the highest rate in the radiation-hardened electronics industry. The nuclear power industry, as well as the defence and space industries, mostly use RHBD memory, microcontrollers, and ASICs. Because RHBD permits simple adjustments by various government programmes depending on the desired applications, the demand for RHBD designs is accentuated during COVID-19. Despite being a successful method for producing radiation-hardened electronics systems, radiation hardening by process (RHBP) has a lower adoption rate among microelectronics producers. This is mostly due to low profits, process uncertainties, and high manufacturing costs.
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The biggest market share for radiation-hardened electronics was held by North America.
Leading businesses like Honeywell Aerospace & Defense (US), Microchip Technology (US), and Xilinx, Inc. (US) as well as renowned space research institutions like the National Aeronautics and Space Administration (NASA), the Florida Space Research Institute (FSRI), and the Keck Institute for Space Studies are both responsible for the growth in North America (KISS). Due to the numerous space missions and military operations that are carried out globally, the US supplies the majority of rad-hard components (nearly 50%) to many regions of the world. Despite the stagnant economic growth and DoD budget costs, the demand for radiation-hardened electronics products is anticipated to remain high. On the other hand, over the projected period, Europe is also anticipated to provide the makers of rad-hard components interesting chances. The rad-hard market is predicted to grow at the greatest CAGR in APAC. The region is anticipated to experience rapid expansion in the next years thanks to advanced manufacturing technology capabilities and improved economic conditions in China, India, and Japan.
Key Players
The leading companies in the global radiation-hardened electronics market are Bae Systems (UK), STMicroelectronics (Switzerland), Microchip Technology (US), Renesas Electronics (Japan), Honeywell Aerospace & Defense (US), and Infineon Technologies (Germany).
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